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Thermal glucose, electrons, high-conducted thermal silica gel, composite adhesive, heat glucose.
Thermal glucose, electrons, high-conducted thermal silica gel, composite adhesive, heat glucose.
Thermal glucose, electrons, high-conducted thermal silica gel, composite adhesive, heat glucose.
Thermal glucose, electrons, high-conducted thermal silica gel, composite adhesive, heat glucose.

Thermal glucose, electrons, high-conducted thermal silica gel, composite adhesive, heat glucose.

ManufacturerNofon Electronics Technology Ltd., Shenzhen City
CategorySynthetic glue
Price28.0
Imported or notYes
BrandNofon.
Goods002.
Packaging specifications30CC / 100g
Type of glued materialElectronic element
Cut strength1.4
Specifications20
Validation period24
Working temperature40-200
Sticky100,000 C
Solidk
OriginShenzhen.
Valid period2 years
FunctionsHigh-conductor heat, unconsolidated, good permeability.
Scope of useNew vehicles, mobile phones, electronic devices.
SeriesNF-200L
Product number12-2
Order number1122
Product nameThermal gel.

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